Full-service SMT, through-hole, and mixed-technology PCB assembly backed by 3D AOI, X-ray inspection, and in-circuit testing. Whether you need 5 prototype boards or 500,000 production units, PCB Insider delivers assembled PCBs with zero-defect quality and on-time reliability.
PCB assembly is the critical step where your electronic design becomes a functioning product. A single misplaced component, a cold solder joint, or a wrong-value resistor can mean failed prototypes, delayed product launches, and costly field returns. The difference between a mediocre PCBA supplier and a reliable one often shows up not in the price per board, but in the total cost of quality — rework, delays, and warranty claims that erode your margin.
At PCB Insider, PCB assembly is our core manufacturing discipline — not a side service bolted onto bare board fabrication. Our facility operates 8 dedicated SMT production lines with the latest high-speed pick-and-place equipment, 10-zone reflow ovens with nitrogen capability, and comprehensive inspection systems including 3D AOI, X-ray, and in-circuit testing. Every line is staffed by IPC-certified operators who understand that quality starts at solder paste printing and extends through final functional test.
From quick-turn prototype assembly to high-volume production runs, we provide a single-source PCBA solution that simplifies your supply chain. Our turnkey service handles component sourcing from authorized distributors, eliminating counterfeit risk and freeing your procurement team to focus on strategic activities. Combined with our cable assembly and wire harness manufacturing capabilities, we can deliver fully integrated electronic sub-assemblies ready for your final product.
Advanced SMT assembly, through-hole insertion, BGA rework, and comprehensive testing — all under one roof with full process traceability.
High-speed automated SMT lines with multi-head pick-and-place machines capable of placing components as small as 01005 (0.4mm x 0.2mm). Handles fine-pitch QFP, BGA, QFN, and micro-BGA with placement accuracy of ±25 microns.
Manual and automated through-hole insertion for connectors, transformers, relays, and power components. Wave soldering and selective soldering ensure consistent solder joints on high-thermal-mass components.
Integrated SMT and through-hole assembly on the same board. Our process flow handles double-sided SMT with through-hole components, eliminating the need for multiple assembly vendors.
Specialized BGA, CSP, PoP (Package-on-Package), and flip-chip assembly with nitrogen reflow. X-ray inspection verifies solder joint integrity beneath every BGA — no hidden defects leave our facility.
3D AOI systems inspect every board for solder bridges, missing components, tombstoning, polarity errors, and insufficient solder. Real-time defect detection catches issues before they propagate through production.
2D and 3D X-ray inspection for BGA, QFN, and hidden solder joints. In-circuit testing (ICT) verifies component values, opens, shorts, and basic functional parameters on every production board.
Full turnkey service where we source all components from authorized distributors, or consigned assembly using your supplied parts. Hybrid models available — we source commodity parts while you supply specialty components.
Acrylic, silicone, urethane, and epoxy conformal coatings for moisture, dust, and chemical protection. Selective coating with automated dispensing ensures connectors and test points remain accessible.
Custom functional test fixtures verify board-level and system-level operation. IC programming, firmware flashing, and burn-in testing ensure every assembled board is production-ready out of the box.
| Parameter | Specification |
|---|---|
| Component Size (Min) | 01005 (0.4mm x 0.2mm) |
| BGA Pitch (Min) | 0.3mm |
| Fine-Pitch QFP | Down to 0.4mm pitch |
| Placement Accuracy | ±25 microns |
| Placement Speed | 80,000 CPH per line |
| Board Size (Max) | 510mm x 460mm |
| Board Thickness | 0.4mm – 4.0mm |
| Solder Paste Types | SAC305 (lead-free), Sn63/Pb37 (leaded) |
| Reflow Zones | 10-zone convection with nitrogen capability |
| Stencil Technology | Laser-cut stainless steel, nano-coated |
| Prototype Lead Time | 24 hours – 5 business days |
| Production Lead Time | 1 – 3 weeks (volume dependent) |
A 7-step production process with built-in quality gates at every stage — from DFM analysis through final shipment.
Upload your Gerber files, BOM, and pick-and-place data. Our engineering team performs a comprehensive Design for Manufacturing and Design for Assembly analysis — identifying potential issues with pad geometries, component footprints, solder paste apertures, and thermal relief before any board enters production.
For turnkey orders, we source all components from authorized distributors and maintain full traceability. Our procurement team cross-references your BOM against current stock availability, identifies lead-time risks, and recommends drop-in alternatives for obsolete or constrained parts — keeping your project on schedule.
Laser-cut stainless steel stencils apply solder paste with micron-level precision. Solder Paste Inspection (SPI) systems measure paste volume, height, and alignment on every pad before component placement — catching print defects before they become assembly defects.
Multi-head pick-and-place machines populate boards at up to 80,000 components per hour. Vision-guided alignment ensures every component — from 01005 passives to large BGAs — lands precisely on its target pads. Automatic feeder verification prevents wrong-part loading.
10-zone convection reflow ovens with nitrogen atmosphere create optimal thermal profiles for lead-free and leaded assemblies. Through-hole components go through selective soldering or wave soldering with real-time temperature monitoring and automatic flux application.
3D AOI inspects every board post-reflow. X-ray examines BGA and hidden solder joints. In-circuit testing verifies component values and connectivity. Functional testing confirms board-level operation. Each inspection layer builds on the previous, ensuring comprehensive defect coverage.
Ultrasonic or aqueous cleaning removes flux residues. Optional conformal coating protects boards destined for harsh environments. Final visual inspection per IPC-A-610 workmanship standards, serialization, and packaging complete the process before shipment.
Our PCB assembly services support mission-critical electronics across industries where failure is not an option.
Engine control units, ADAS sensors, infotainment systems, EV battery management boards, and dashboard instrument clusters. IATF 16949 compliant assembly with automotive-grade component sourcing.
Patient monitoring systems, diagnostic instruments, imaging equipment controllers, and implantable device electronics. ISO 13485 compatible processes with full lot traceability and IPC Class 3 workmanship.
PLC controllers, motor drives, sensor modules, industrial HMI boards, and IoT gateway electronics. Conformal coating and extended temperature range components for demanding factory floor environments.
5G base station boards, network switches, RF front-end modules, fiber optic transceivers, and antenna tuning units. High-frequency laminate assembly with impedance-controlled processes.
Wearable device boards, smart home controllers, audio equipment, LED lighting drivers, and power adapters. High-volume assembly with cost optimization and rapid product iteration support.
Avionics boards, radar processing units, satellite communication modules, and missile guidance electronics. IPC-A-610 Class 3 assembly with MIL-spec components and conformal coating per MIL-I-46058.
“In PCB assembly, the cost of a defect multiplies at every stage — a $0.02 solder bridge becomes a $200 rework at board level, a $2,000 failure at system test, and a $20,000 field return after deployment. That's why we invest heavily in prevention — SPI, AOI, X-ray, and ICT — catching defects when they cost pennies, not thousands.”
All PCB assemblies inspected to IPC-A-610 workmanship standards. Class 3 high-reliability assembly available for aerospace, defense, medical, and other safety-critical applications.
Certified quality management system with documented procedures for every manufacturing step, from incoming inspection through final shipment and customer feedback tracking.
Every board passes through 3D automated optical inspection. Boards with BGA, QFN, or other hidden-joint components receive mandatory X-ray inspection — 100%, not sampling.
Lot-level traceability from component purchase order through finished assembly. Solder paste batch, reflow profile, stencil ID, and operator records linked to every board serial number.
Entire production floor is ESD-protected per ANSI/ESD S20.20. Continuous monitoring of wrist straps, floor mats, and ionization systems protects sensitive components throughout assembly.
Full RoHS and REACH compliance with certificates of conformance. Lead-free and leaded processes run on separate dedicated lines to prevent cross-contamination.
To provide an accurate quote, we need your Gerber files (or ODB++ data), a Bill of Materials (BOM) in Excel format with manufacturer part numbers, and a centroid/pick-and-place file with component X-Y coordinates and rotation. If you only have a schematic or partial documentation, our engineering team can still provide a preliminary estimate and guide you on the additional data needed.
We have no hard minimum — we regularly assemble single prototype boards as well as production runs of 100,000+ units. Our flexible manufacturing setup uses quick-change feeders and modular programming to make small-batch assembly cost-effective. For quantities under 50 boards, a one-time NRE (Non-Recurring Engineering) fee covers stencil fabrication and program setup.
Yes, turnkey assembly is our most popular service model. We source all components from authorized distributors (Digi-Key, Mouser, Arrow, Future Electronics) and maintain full chain-of-custody documentation. We also offer consigned assembly if you prefer to supply your own components, and hybrid models where we source standard parts while you supply specialty or customer-specified components.
Our quick-turn prototype service delivers assembled boards in as little as 24 hours after components and bare boards are available. Standard prototype lead time is 3–5 business days including component sourcing. For the fastest turnaround, provide a BOM using commonly stocked components and we can often ship assembled prototypes within 48 hours of order confirmation.
Every production run includes solder paste inspection (SPI) after stencil printing, 3D automated optical inspection (AOI) after reflow, and visual inspection per IPC-A-610 standards. For boards with BGA or QFN components, X-ray inspection is performed automatically. In-circuit testing (ICT) and functional testing are available as additional services and are recommended for production volumes.
We support both lead-free (RoHS compliant SAC305) and leaded (Sn63/Pb37) assembly processes on dedicated production lines. This separation prevents cross-contamination and ensures compliance with your specific regulatory requirements. Our reflow ovens have programmable profiles optimized for each solder alloy, and our wave soldering systems maintain separate solder pots for leaded and lead-free processes.
Precision-engineered cable assemblies with custom connectors, overmolding, and EMI shielding for any application.
Learn MoreComplex multi-branch wire harnesses with custom routing, breakouts, and full continuity testing.
Learn MoreComplete electromechanical assembly including enclosure, wiring, PCB integration, and end-of-line system testing.
Learn MoreUpload your Gerber files and BOM to receive a detailed DFM review and competitive quote within 24 hours. From single prototype boards to high-volume production, our team is ready to bring your PCB design to life.
Quick-turn prototypes from 24 hours | No minimum order quantity