Manufacturing Excellence
Advanced PCB Capabilities for Every Application
Explore our comprehensive PCB capabilities and manufacturing specifications. From standard PCB specifications to advanced HDI PCB capabilities, we deliver precise manufacturing for demanding applications. Our PCB capabilities cover multilayer PCB, flexible PCB, high-frequency PCB, and heavy copper PCB manufacturing.
32
Max PCB Layers
2 mil
Min Trace Width
0.1mm
Laser Via Size
13oz
Max Copper Weight
±5%
Impedance Tolerance
PCB Manufacturing Specifications
Detailed PCB specifications and capabilities for standard and advanced manufacturing. Our PCB capabilities meet the most demanding design requirements.
PCB Fabrication Capabilities
| PCB Specification | Standard Capability | Advanced Capability |
|---|---|---|
| Layer Count | 1-8 Layers | Up to 32 Layers |
| Board Thickness | 0.4mm - 2.4mm | 0.2mm - 6.0mm |
| Copper Weight | 0.5oz - 2oz | 0.5oz - 13oz |
| Min Trace Width | 4 mil (0.1mm) | 2 mil (0.05mm) |
| Min Trace Spacing | 4 mil (0.1mm) | 2 mil (0.05mm) |
| Min Drill Size | 0.25mm | 0.1mm (Laser) |
| Aspect Ratio | 8:1 | 16:1 |
| Impedance Tolerance | ±10% | ±5% |
PCB Material Capabilities
FR-4TG130-180
Standard PCB material for most applications
High-TG FR-4TG170+
Enhanced thermal stability for lead-free soldering
RogersN/A
High-frequency PCB material for RF applications
AluminumN/A
Metal core PCB for LED and power electronics
Polyimide (PI)TG250+
Flexible PCB material for flex circuits
CeramicN/A
High-performance PCB for extreme environments
PCB Surface Finish Options
HASL Lead-FreeShelf: 12 months
Hot Air Solder Leveling - cost-effective PCB finish
ENIGShelf: 12 months
Electroless Nickel Immersion Gold - excellent solderability
OSPShelf: 6 months
Organic Solderability Preservative - flat surface for SMT
Immersion SilverShelf: 6 months
Good for fine pitch components and wire bonding
Immersion TinShelf: 6 months
Lead-free finish with good solderability
Hard GoldShelf: 12+ months
Thick gold plating for edge connectors and contacts
Advanced PCB Capabilities
Our advanced PCB manufacturing capabilities support the most challenging designs. From HDI PCB to high-frequency PCB, explore our specialized PCB capabilities.
HDI PCB Capabilities
Our HDI PCB capabilities include microvias, blind vias, buried vias, and sequential lamination. HDI PCB manufacturing enables higher density routing for compact designs.
- Microvia 0.1mm
- Sequential Lamination
- Any-Layer HDI
Flexible PCB Capabilities
Advanced flexible PCB capabilities for dynamic flex applications. Our flex PCB specifications support single-sided, double-sided, and multilayer flexible circuits.
- Single & Double Layer Flex
- Rigid-Flex PCB
- Dynamic Flex
High-Frequency PCB
PCB capabilities for RF and microwave applications. High-frequency PCB manufacturing with Rogers, Taconic, and other low-loss materials.
- Rogers/Taconic Materials
- Controlled Impedance
- Low Dk/Df
Metal Core PCB
Aluminum and copper core PCB capabilities for thermal management. Metal core PCB specifications designed for LED lighting and power electronics.
- Aluminum Core
- Copper Core
- Thermal Conductivity 1-3 W/mK
Heavy Copper PCB
Heavy copper PCB capabilities up to 13oz copper weight. Ideal for high current applications, power supplies, and automotive electronics.
- Up to 13oz Copper
- Mixed Copper Weights
- Extreme Current Handling
Ultra-Fine Pitch
PCB capabilities for ultra-fine pitch components and tight tolerances. Advanced manufacturing specifications for high-density interconnect designs.
- 2mil Trace/Space
- Fine Pitch BGA
- Laser Direct Imaging
PCB Assembly Capabilities
Our PCB assembly capabilities complement our fabrication services. Advanced SMT assembly capabilities handle ultra-fine pitch components. PCB assembly specifications include 3D AOI, X-ray inspection, and comprehensive testing.
Assembly Specifications
| Capability | Standard | Advanced |
|---|---|---|
| Component Package | 0402 (Imperial) | 01005 (Imperial) |
| BGA Pitch | 0.5mm | 0.3mm |
| QFN/QFP Pitch | 0.5mm | 0.4mm |
| Placement Accuracy | ±0.05mm | ±0.025mm |
| Reflow Zones | 8 Zones | 12 Zones |
| AOI Capability | 2D AOI | 3D AOI + X-Ray |
Manufacturing Equipment
PCB Fabrication
- CNC Drilling Machine
- Laser Direct Imaging (LDI)
- Automatic Optical Inspection (AOI)
- Flying Probe Tester
PCB Assembly
- High-Speed SMT Pick & Place
- Reflow Oven (12-Zone)
- Wave Soldering Machine
- Selective Soldering System
Quality Control
- 3D X-Ray Inspection
- In-Circuit Tester (ICT)
- Functional Test System
- Thermal Cycling Chamber
Quality Certifications
Our PCB capabilities are backed by international quality certifications. Every PCB manufactured meets strict quality standards.
ISO 9001:2015
ISO 14001:2015
IATF 16949
ISO 13485
ISO 9001:2015
Quality Management System certification ensuring consistent PCB quality
ISO 14001:2015
Environmental Management System for sustainable PCB manufacturing
IATF 16949
Automotive quality standard for automotive PCB applications
ISO 13485
Medical device quality management system certification
IPC-A-610 Class 2/3
Acceptability standard for electronic assemblies
RoHS Compliant
Restriction of Hazardous Substances for environmental compliance
PCB Capabilities FAQ
Common questions about our PCB manufacturing capabilities and specifications.
What are your maximum PCB layer capabilities?
Our PCB capabilities support up to 32 layers for complex multilayer PCB designs. Standard PCB specifications cover 1-8 layers, while advanced capabilities extend to HDI PCB with sequential lamination up to 32 layers.
What PCB materials are available?
Our PCB material capabilities include FR-4 (standard and high-TG), Rogers for high-frequency PCB, aluminum for metal core PCB, and polyimide for flexible PCB applications. Each material meets specific PCB specifications for different applications.
What are your minimum trace width and spacing capabilities?
Standard PCB capabilities include 4 mil (0.1mm) trace width and spacing. Advanced PCB specifications support 2 mil (0.05mm) trace/space for high-density designs using laser direct imaging technology.
Do you offer controlled impedance PCB capabilities?
Yes, our PCB capabilities include controlled impedance with ±10% tolerance for standard and ±5% for advanced specifications. Impedance-controlled PCB is available for all layer counts and most PCB materials.
What PCB surface finishes are available?
Our surface finish capabilities include HASL (lead-free), ENIG, OSP, immersion silver, immersion tin, and hard gold. Each finish meets specific PCB specifications for solderability and reliability.
Explore Our Services & Resources
Need Custom PCB Capabilities?
Our PCB capabilities can be customized to meet your specific requirements. Contact our engineering team to discuss your PCB specifications and get expert guidance on your project.