Rigid-Flex PCB Fabrication
Advanced rigid-flex manufacturing eliminating connector failures and reducing assembly weight. We support up to 20 layers with adhesiveless Polyimide construction, ensuring reliability in dynamic flex applications with a bend radius as low as 3x the thickness.
Why Rigid-Flex Matters
Complex Multi-Layer Stackups
We fabricate rigid-flex boards up to 20 layers, managing the coefficient of thermal expansion (CTE) mismatch between Polyimide flex cores and FR4 rigid...
Precision Micro-Vias
Capabilities include laser-drilled micro-vias as small as 0.1mm in flex areas, enabling high-density interconnect (HDI) designs that reduce board footprint...
Adhesiveless Construction
Standard use of adhesiveless laminates (e.g., DuPont Pyralux AP) eliminates the risk of adhesive flow-out during lamination, providing superior dimensional...
Controlled Impedance
We provide precise impedance matching for differential pairs and single-ended traces, accounting for the heterogeneous dielectric properties of hybrid...
Capability Comparison
Rigid-flex fabrication requires specialized lamination cycles and material handling compared to standard rigid boards. Below is how our capabilities stack up against typical industry standards.
| Parameter | Industry Standard | PCB Insider Capability |
|---|---|---|
| Layer Count | Up to 8 Layers | Up to 20 Layers |
| Min. Trace/Space | 4/4 mil (0.1mm) | 3/3 mil (0.075mm) |
| Min. Drill Size (Mechanical) | 0.3mm | 0.15mm |
| Dynamic Bend Radius | 10x Thickness | 3x Thickness |
| Flex Material Type | Adhesive-based Polyimide | Adhesiveless (Standard) |
| Dimensional Tolerance | ±0.15mm | ±0.075mm |
Fabrication Process
1
DFM & Stackup Review
Engineers analyze your Gerber files to optimize the layer stackup, ensuring neutral axis placement for bend areas and verifying impedance requirements.
2
Imaging & Etching
We use LDI (Laser Direct Imaging) for high precision, especially critical for the fine traces required in flex zones, ensuring minimal undercut.
3
Lamination
Rigid and flex cores are aligned and laminated using vacuum press cycles. This step removes air pockets and bonds the layers without excessive adhesive flow.
4
Electrical Test
100% flying probe testing verifies continuity and isolation. We perform impedance testing on controlled impedance nets to ensure signal integrity.
Case Study: Industrial Drone Controller
Challenge
An aerospace client needed to reduce the weight of a flight controller module by 30% while increasing resistance to high-frequency vibration. Traditional connectors were failing due to shock.
Solution
We designed a 10-layer rigid-flex PCB replacing 3 separate boards and 2 ribbon cables. Used adhesiveless Polyimide for the flex sections and FR4 for the processor mounting areas. Implemented plated half-holes for edge mounting.
Results
Achieved 35% total weight reduction and eliminated 100% of board-to-board connector failures. Withstood 20G random vibration testing. Passed IPC-6013 Class 3 inspection.
Frequently Asked Questions
What is the minimum order quantity (MOQ) for rigid-flex PCBs?
We support low-volume prototyping with an MOQ of 1 piece for design validation. For production runs, our MOQ starts at 10 panels to ensure cost efficiency while maintaining strict process control during lamination and drilling.
What materials do you use for rigid-flex circuits?
We utilize Polyimide (Kapton) and adhesiveless laminates (e.g., Panasonic R-F775, DuPont Pyralux) for the flex sections to ensure thermal stability. For rigid sections, we use high-Tg FR4 (ISOLA 370HR, Rogers) to manage CTE mismatch and prevent delamination.
How do you handle impedance control in rigid-flex designs?
We calculate stackups using Polar Si8000 or similar field solvers to account for the dielectric constant variations between flex and rigid materials. We guarantee single-ended impedance tolerance of ±10% and differential impedance of ±5% for signal integrity.
What are the typical lead times for rigid-flex fabrication?
Standard lead time for 4-8 layer prototypes is 10-12 working days. Complex designs (12+ layers) with blind/buried vias typically require 15-18 days. Expedited 5-day turnaround is available for simple 2-4 layer constructions.
Can you manufacture rigid-flex boards with adhesiveless construction?
Yes, adhesiveless construction is our standard for high-reliability applications. It offers better dimensional stability, higher thermal resistance, and a thinner profile compared to adhesive-based cores, making it ideal for dynamic flex applications.
What file formats do you require for manufacturing?
We accept Gerber RS-274X, ODB++ (v7.0 or higher), and IPC-2581. Please include a separate fabrication drawing noting layer stackup, material specifications, impedance requirements, and bend radius constraints.
Ready to Optimize Your Design?
Our engineering team provides free DFM reviews for rigid-flex designs. Upload your files to ensure your stackup is optimized for manufacturability and cost.
Start Your ProjectReviewed by: Engineering Team, pcbinsider | Last updated: 2026-04-14