Thermal Via Calculator
Design thermal via arrays for heat dissipation
Input Parameters
Results
Recommended Via Array
3 × 3(9 vias)
Pitch: 1.00 mm
Single Via R
192.4 °C/W
Array R
21.38 °C/W
Actual Temp Rise
21.4 °C
Heat Transfer
1.87 W
Design Guidelines
- Use via-in-pad for best thermal performance
- Fill vias with copper or conductive epoxy
- Connect to large copper pour on opposite side
- Minimum 0.6mm pitch for standard process
Via Fill Options
Copper Filled
Best thermal: ~385 W/m·K
Conductive Epoxy
Good: ~2-4 W/m·K
Non-Conductive Fill
Poor: ~0.2 W/m·K