Design thermal via arrays for heat dissipation
Recommended Via Array
Pitch: 1.00 mm
Single Via R
192.4 °C/W
Array R
21.38 °C/W
Actual Temp Rise
21.4 °C
Heat Transfer
1.87 W
Copper Filled
Best thermal: ~385 W/m·K
Conductive Epoxy
Good: ~2-4 W/m·K
Non-Conductive Fill
Poor: ~0.2 W/m·K