Solder Paste Calculator
Stencil aperture design & paste release analysis
Input Parameters
Stencil: 0.12mm
Paste on Pad
Analysis Results
excellent Paste Release
Optimal paste release expected. Standard process.
Aperture Size
1 × 0.5 mm
Area Ratio
1.39
Target: ≥0.66
Aspect Ratio
4.17
Target: ≥1.5
Paste Volume
0.06 mm³
Actual Deposit
0.051 mm³
85% transfer
Min Aperture Width
0.18 mm
For aspect ratio ≥1.5
Recommended stencil for chip: 0.1-0.15mm (typical 0.12mm)
IPC-7525 Guidelines
Area Ratio
≥0.66 for reliable release
= Aperture Area / Wall Area
Aspect Ratio
≥1.5 for good paste deposit
= Width / Thickness
Stencil Thickness Guide
0201/010050.08mm
0402/BGA0.10mm
0603/08050.12mm
1206+0.15mm
Tips
- • Nano-coating improves release by 10-15%
- • Electroformed stencils for fine-pitch
- • Step stencil for mixed components
- • Trapezoidal walls improve release