Solder Joint Calculator
Analyze solder joint reliability and thermal fatigue life
Joint Parameters
Reliability Analysis
Good - Moderate strain, acceptable fatigue life
Shear Strain
1.67%
Fatigue Life
1
cycles
CTE Mismatch
10.0
ppm/°C
DNP
5.00 mm
Joint Height
0.30 mm
Aspect Ratio
0.75
Pad Area
0.126 mm²
Material CTE Reference
| Material | CTE (ppm/°C) | Application |
|---|---|---|
| Silicon (Die) | 2.6-3.0 | IC chips |
| Alumina (Ceramic) | 6.5-7.0 | Ceramic packages |
| FR-4 PCB | 14-17 | X-Y plane |
| Copper | 17 | Traces |
| BT Substrate | 12-15 | BGA substrates |
| Polyimide Flex | 12-20 | Flex circuits |
| Aluminum | 23 | Heatsinks |
Larger CTE mismatch and DNP increase shear strain. Use underfill for large BGAs to improve fatigue life. Corner joints experience the highest strain and fail first.
Need Reliable Assembly?
We provide DFM analysis and reliability testing for critical applications.
Get Free Quote