Tools/Solder Joint Calculator

Solder Joint Calculator

Analyze solder joint reliability and thermal fatigue life

Joint Parameters

Component Type

Ball Diameter (mm)

Pad Diameter/Width (mm)

Standoff Height (mm)

Die/Package Size (mm diagonal)

Temperature Cycling Range (°C)

PCB CTE (ppm/°C)

Component CTE (ppm/°C)

Reliability Analysis

Good - Moderate strain, acceptable fatigue life

Shear Strain

1.67%

Fatigue Life

cycles

CTE Mismatch

10.0

ppm/°C

DNP

5.00 mm

Joint Height

0.30 mm

Aspect Ratio

0.75

Pad Area

0.126 mm²

Material CTE Reference

Material	CTE (ppm/°C)	Application
Silicon (Die)	2.6-3.0	IC chips
Alumina (Ceramic)	6.5-7.0	Ceramic packages
FR-4 PCB	14-17	X-Y plane
Copper	17	Traces
BT Substrate	12-15	BGA substrates
Polyimide Flex	12-20	Flex circuits
Aluminum	23	Heatsinks

Larger CTE mismatch and DNP increase shear strain. Use underfill for large BGAs to improve fatigue life. Corner joints experience the highest strain and fail first.

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