SMD Pad Calculator
IPC-7351 compliant land pattern design
Component Parameters
Courtyard: 2.8 × 1.36 mm
Land Pattern Results
Pad Size
0.98 × 0.86 mm
Pad Spacing (C-C)
1.32 mm
Gap Between Pads
1.04 mm
Courtyard
2.8 × 1.36 mm
Stencil Aperture
0.83 × 0.73 mm
Pad X Position
±0.66 mm
Paste Area Ratio
72%
Density Level B: Nominal for standard SMT assembly
IPC Density Levels
Level A - Most
Producibility, hand soldering, rework
Level B - Nominal
Standard manufacturing, balanced
Level C - Least
High density, minimal land
Size Reference
02010.6 × 0.3 mm
04021.0 × 0.5 mm
06031.6 × 0.8 mm
08052.0 × 1.25 mm
12063.2 × 1.6 mm