Power Dissipation Calculator
Calculate power loss and thermal performance
Component Parameters
Thermal Parameters
Thermal Analysis
IC: 5V × 100mA
Excellent thermal margin
Power Dissipation
500.0
mW
Junction Temp
50.0°C
Max: 125°C
Temperature Rise
25.0°C
Max Power @ Ta
2.00 W
Thermal Derating
40%
Typical Thermal Resistance (θJA)
| Package | θJA (°C/W) | Notes |
|---|---|---|
| SOT-23 | 200-300 | Small signal |
| SOT-223 | 60-80 | Medium power |
| SOIC-8 | 100-150 | Standard |
| QFN (exposed pad) | 25-40 | Good thermal |
| TO-220 (no heatsink) | 50-65 | Through-hole |
| TO-220 + heatsink | 5-15 | With heatsink |
| D2PAK | 40-60 | Power SMD |
Junction temperature = Ambient + (Power × θJA). Add thermal vias, copper pours, and heatsinks to reduce θJA. Always verify with actual measurements under operating conditions.
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