Analyze SSO/SSN induced ground bounce
400 mV
Ground bounce is within safe limits. No issues expected.
Bounce vs Vcc
12.1%
di/dt
160.0 MA/s
Effective Inductance
2.50 nH
Noise Margin (Low)
990 mV
Total Switch Current
160 mA
Recommended GND Pins
3
Simultaneous switching noise is a package and interconnect effect that appears when many outputs change state at the same time. Ground bounce refers to the resulting shift on the local return node, while VCC sag is the matching disturbance on the power side.
These effects matter because logic thresholds are referenced to supply rails. If the induced disturbance is a large fraction of the noise margin, the interface can misread a clean waveform as a logic error.
Ground bounce is a transient voltage shift on a device ground reference caused by inductance and rapid current change during simultaneous switching.
Package and return-path inductance multiply with di over dt, which directly sets the bounce voltage seen at the silicon pins.
Common actions include adding more ground pins, slowing edge rates, improving decoupling, shortening return loops, and choosing lower-inductance packages.
It becomes critical when bounce voltage consumes a large fraction of the input noise margin or corrupts threshold crossings on neighboring signals.
No. This calculator is a first-pass estimator. Final validation should include package models, stackup data, and channel simulation when margins are tight.