TQFP vs. LQFP: A Quad Flat Package Comparison Guide

Welcome to this TQFP vs. LQFP guide.  The IC must be provided with the best optimal performance conditions to ensure the excellent performance of miniature body-size devices. 

Manufacturers achieve this by carefully covering parts in a package. 

But why is this process necessary, and what are the properties of the various flat packages used in the industry? 

By the end of this article, you should tell the relationship/difference between IC package types. Hence, for more detailed insights, read on. 

What is a TQFP Package?

QFP’ is an acronym for ‘Quad Flat Package’ while the ‘T’ in TQFP represents ‘Thin,’ meaning that it is a small-width package. 

So what is the primary identifying characteristic of a TQFP package family? 

As earlier highlighted, this is a type of enclosure for integrated circuits characterized by flappy structures hanging from the corners of its perimeter. 

Being a flatpack package type, it has the primary upside of providing a small body size. It is highly important in most modern-day mobile devices.  

Features of  a Thin Quad Flat Package (TQFP)

An IC package. 

An IC package. 

  • The surface-mounted integrated circuit package features 32 to 256 pins hanging by its sides from which it connects to the PCB. 
  • This standard for packing surface is among the thinnest packages, with a lead pitch range of 0.48 to 0.8mm. It also occupies very little space on the PCB, with an overall body thickness of 1.4mm. 
  • Its ideal setup condition is under a low loop wire bonding process, and today, it is the US’s primary military standard flat package method.
  • Also, it is most useful when the aim is to create a perfect enclosure for small board-density parts
  • Lastly, the fundamental role of this package on circuit boards is to protect the IC from harmful elements and physical damage. 

Benefits of the TQFP IC Package

An IC on a circuit board. 

An IC on a circuit board. 

Small Form Factor and Portability

Modern-day ICs are designed to fit into small devices to feed the increasing need for portability. 

As such, the IC package must also be small, and this is where the TQFP becomes very significant. 

This package comes with short leads meaning it’ll occupy very minimal space on the device. 

With such a technology, it is straightforward to design systems such as mobile phones without the worry that the size of the IC could be a hindrance. 

Also, we have frequency applications that require a package that fits IC parts into a small size, and the TQFP IC package perfectly ticks this box. 

The packaging is also crucial in reducing aspects such as the inductance, resistance, and capacitance of the IC. 

Solving Die Shrinking

Design chip contents are prone to size decrease, especially if the die wire is thick enough to hold the IC in place.

 With the TQFP packaging process, manufacturers can prevent this challenge by using a thicker wire, thus withstanding the chip’s weight.  

Environment Friendliness

The use of lead-free or green materials is the primary hack to realizing environment-friendly electronic parts, which is the standard for this component’s packing method. 

It means that in addition to keeping our environments clean, using these materials ensures that it complies with industry standards like RoHS

Enhancing Reliability

The TQFP makes this package more reliable than others primarily because of its high pins volume. 

It also ranks among the best packages for enhancing the IC’s thermal stability, top-level performance cardinal feature, and guaranteeing component dependability. 

Limitations of the TQFP IC Package

Hand Solder IC. 

Hand Solder IC. 

  • The PCB soldering process is easy but can become complex when the parts are so close. And this is usually the case with TQFP packages primarily because the pins are so closely packaged that it’s impossible to put the solder on just one part without the risk of it spreading to unintended points on the PCB. 
  • In addition to the demand for soldering expertise needed for the package, the closeness of the pins is also a significant problem and may cause short-circuiting. The parts are so close to each other that working on the package is also challenging. 

Possible TQFP Use Challenges

  • The closeness of the pins poses a significant issue of destruction during the handling process. But manufacturers apply the precise pick and place machines during the attachment as it eliminates chances for error. 
  • Pin overlap is also common with these packages, and it takes quite a lot of effort to keep the individual pin parts away from each other. 

TQFP vs. LQFP: The Major Difference

A TQFP encoding an IC. 

A TQFP encoding an IC. 

  • The Low-Profile Quad Flat Package (LQFP) shares a package size with the TQFP, but the TQFP features shorter leads. 

It means that LQFP solves the mounting problem synonymous with TQFP primary because its characteristic long leads are easy to mount. 

  • Secondly, the TQFP is essential in scenarios where the aim is to minimize the PCB thickness thanks to the short leads that occupy a relatively small height. 
  • Thirdly, they differ in lead count range. Although the minimum number of leads in each package is the same at 32, there’s a significant difference in the maximum numbers. LQFP leads are up to 208, while the number in TQFP is 176. 

Besides this significant difference, the packages are similar in all other aspects, as they are quad-flat packages. 

Applications of TQFP

A Microcontroller. 

A Microcontroller. 

This mounting package for ICs is common in telecommunications and computing applications. Other major uses include the following parts and devices: 

  • Video or audio components
  • Data systems
  • Laptops and Tabs chips
  • Microcontroller and gate arrays. 

Benefits of TQFP’s Surface Mount Technology (SMT)

  • Electronic products optimally function when there’s optimal electromagnetic conductivity, which is the primary upside to using TQFPs on electronic parts. 
  • The prongs/lead on the TQFPs ensures that it is easy to lay the parts, especially using machines. 


While TQFP discovery came with many challenges, such as the demand for sophisticated and careful soldering procedures, the technology has had its fair share of upsides.

Today, we can keep the IC and other integral inner electronics safe and functioning optimally. 

Also, manufacturers have invested in state-of-the-art equipment that enables a seamless connection of surface mount components on a circuit board. 

So the future of TQFP and LQFP is brighter than ever.